BEST BST-082 For iPhone 13 Series CPU Soldering Reballing Stencil Cell Phone Magnetic Tinning Plate

• There is a strong magnet embedded in the base, and strong magnetic adsorption, so that the positioning is accurate, does not deviate, and the magnetism does not change at high temperatures
• High temperature resistant, not easy to deform, non-sticky, easy to get off the net
• Every tin dot is as full as a pearl. Suitable for iPhone 13 series motherboard mid-layer repair
• Strong magnetic adsorption for a tight fit. With precise positioning alignment holes for more convenience
• CNC high-precision integrated processing, stencil and pad precision alignment stable positioning scraping tin ball implantation without deviation

Compatible with

• Universal Models
• Universal

Package included

• 1 x Set of CPU Soldering Reballing Stencil

Specifications