BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
90 NOK
Made by high quality metal material
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing
Compatible with
- Universal Models
- Universal
Package included
- 1 x BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
Specifications
| Brand | N/A |
| Color | As Shown |
| Condition | OEM |
| Logo | Without Logo |
| Parts Type | Others |
| Gross Weight | 0.011kg |
| Volume Weight | 0.009kg |
| Package Length | 10.000cm |
| Package Width | 8.000cm |
| Package Height | 0.500cm |
For finished products, contact by email to finalize the order.
BST-iPH-2 IC Chip BGA Reballing Stencil Solder Template for iPhone 6S/6SP-A9
90 NOK
